Senior Optical Packaging & Assembly Engineer

Psiquantum·Daresburysenior

En corto

→Ingeniero senior especializado en empaquetado óptico para circuitos integrados fotónicos (PIC) en entornos de alta precisión.
→Desarrolla procesos escalables de alineación fibra-chip y colabora con proveedores para validar soluciones de empaquetado.
→Destacado por trabajar en un laboratorio de vanguardia (Daresbury Lab) en un proyecto de computación cuántica de escala utility con financiamiento gubernamental

Proficiency in English required for technical collaboration and documentation.

En ~1 minuto te damos: quién te entrevista, las preguntas probables con respuestas desde tu CV, y tu CV adaptado a esta vacante. Gratis, sin tarjeta.

🎧¿Llegás a la entrevista? Llevá el copiloto. Nuestra extensión escucha la entrevista en vivo y te muestra anclas de 3-4 palabras desde tu CV y tu preparación — mirás, conectás, hablás. Gratis. Ver la extensión →

¿Qué piden?

✓Master's Degree o superior en Ingeniería Óptica, Física o equivalente.
✓3+ años en diseño y calificación de empaquetado de PIC.
✓5+ años de experiencia con óptica y montaje de componentes fotónicos.
✓Experiencia en alineación de fibra a chip con alta precisión.
✓Capacidad para trabajar con proveedores externos y cadena de suministro.
✓Experiencia en desarrollo de prototipos y flujos escalables de empaquetado.

¿No cumplís todo? Es lo normal — tu dossier gratis te dice qué gaps tenés y cómo cubrirlos en la entrevista.

Circuitos integrados fotónicosEmpaquetado ópticoAlineación fibra-chipDiseño de BOMCadena de suministroProveedores externosPrototiposProcesos escalablesComponentes fotónicosColaboración con partners exte

¿A quién escribirle en Psiquantum?

Tu dossier gratis identifica a las personas que te entrevistarían — con su background, qué valoran y cómo escribirles para destacar antes de aplicar.

PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale. PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact. Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. Come join us. Job Summary: The Senior Optical Packaging Engineer is responsible for developing & implementing high-performance, robust & scalable opto-electronic packaging workflows for a variety of chip-based photonic integrated circuits. This work will be carried out in PsiQuantum’s UK R&D facility located in Daresbury Lab. Responsibilities: • Develop an optical package and fibre-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly. • Help develop packaging prototypes & scalable fibre-to-chip packaging flows and processes. • Review packaging design BOMs, work with supply chain on procuring parts needed for assembly. • Work with our internal packaging team and external vendors on transferring & scaling packaging designs and processes based on successful prototypes. • Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements. • Working with external partners to develop advanced opto-electronic packaging solutions. Experience/Qualifications: • Master’s Degree or above in Optical Engineering, Physics or equivalent. • 3+ years of experience working on PIC packaging design & qualification. • 5+ years of experience working with optic

¿Buscando algo parecido?

Dejá tu email y te avisamos cuando salgan vacantes que coincidan con tu perfil.

No apliques sin prepararte

Investigamos quién te entrevista, adaptamos tu CV y te ensayamos en vivo — gratis la primera.