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Jobs / Olix

Optical Interconnect Process Engineer

Olix·London, UKsenior

In short

  • →Ingeniero de procesos para interconexiones ópticas en sistemas de alta densidad y co-packaged optics (CPO).
  • →Trabajas en prototipado, validación, fabricación y escalado, con enfoque en alineación, rendimiento y fiabilidad.
  • →El rol es clave en la implementación de un acelerador de decodificación de próxima generación con arquitectura rack-scale.

Fluency in English required for cross-team collaboration and documentation.

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The questions they'll ask you

1. ¿Cómo diseñarías una estrategia de alineación óptica para interconexiones de alta densidad con tolerancias de 2 µm?

2. ¿Qué factores podrían afectar el rendimiento térmico en un sistema CPO y cómo los mitigarías?

3. Describe un proceso de transferencia de R&D a producción que hayas liderado, incluyendo desafíos clave.

🔒 +7 more questions

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💵 USD · Remote · No visa

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What they ask for

  • ✓Experiencia en microfabricación avanzada y integración de procesos.
  • ✓Habilidades en diseño y optimización de interconexiones ópticas y acoplamiento fibra-chip/paquete.
  • ✓Conocimiento profundo en procesos como fotolitografía, grabado profundo (DRIE/RIE), deposición de películas delgadas.
  • ✓Capacidad para trabajar con fábricas externas, OSATs y fabricantes contractuales.
  • ✓Experiencia en DOE/SPC, documentación de procesos y análisis de variabilidad.
  • ✓Grado en Ciencia de Materiales, Ingeniería Eléctrica/Mecánica o Física.

Don't tick every box? That's normal — your free dossier shows your gaps and how to cover them in the interview.

PhotolithographyDRIE/RIEThin-film depositionPVDALDWafer bondingWet etchJMPPythonFEM

Who should you write to at Olix?

Your free dossier identifies the people who'd interview you — their background, what they value, and how to reach out so you stand out before applying.

About OLIX AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, optics and interconnect enables a step change in system level performance. The Role As an Optical Interconnect Process Engineer at OLIX, you will be responsible for translating optical interconnect architectures into scalable, manufacturable, and reliable hardware. This role focuses on optical packaging, optical alignment, yield, and production readiness for high-density optical systems, and co-packaged optics (CPO). You will work hands-on across prototyping, validation, manufacturing, characterization, and yield, ensuring designs can be built at scale with high performance and reliability. Responsibilities Optical Interconnect Implementation Design and optimise high-density fiber-optic interconnects. Develop fiber-to-chip and fiber-to-package coupling solutions. Develop routing, multiplexing, and signal distribution systems. Define alignment strategies and tolerances for high-volume assembly. Packaging & Integration Drive co-packaged optics (CPO) integration at package and system level. Address opto-mechanical constraints including connectors, fixturing, and alignment. Partner with mechanical and thermal teams on integrated system design. Evaluate thermal interactions between ASICs and photonic components. Process Development & Manufacturing Develop processes for optical assembly, alignment, and test. Apply Design for Manufacturing (DFM) principles to optical systems. Work with foundries, OSATs, and contract manufacturers Support pilot builds and production ramp. Yield, Reliability & Validation Analyze tolerance sensitivities and yield drivers. Investigate variability and resolve production issues. Define and execute validation plans for optical assemblies. Ensure reliability, serviceability, and field-replaceability. Skills & Experience Experience in advanced micro-fabrication, with deep process integration expertise. Experienced collaborating with external fabs, R&D consortia, or tool vendors to develop or transfer new capabilities. Proven record creating or modifying complete process flows for novel optoelectronic devices. Background in some of: photolithography, DRIE/RIE, thin-film deposition (PVD/ALD), wafer bonding, or wet etch. Comfortable switching between hands-on work and high-level process architecture and partner coordination. Proficient in DOE/SPC tools (JMP, Python, etc.) and disciplined process documentation. D. in Materials Science, Electrical/Mechanical Engineering, Physics, or related field. Excellent communicator; thrives in fast-moving, interdisciplinary environments. Nice to have Familiarity with wafer-level packaging or flip-chip integration. Experience transferring R&D processes to external pilot or production environments. Working knowledge of simulation and characterisation (FEM, profilometry, interferometry, L-I-V, or spectral testing). Compensation & Equity Competitive Salary: Commensurate with your experience, skills, and location Equity & Ownership: Meaningful stock options. You’re not just joining the mission; you’re owning a piece of it Proximity Bonus: We value your time. Benefits: Employer-contributed retirement plans to help you build long-term financial security. Due to U.S. export control regulations, candidates’ eli

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